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  • SWIR Series Machine Vision Camera(SWIR,8)

  • Sony Exmor back-illuminated CMOS sensor;
  • Two-step noise reduction technology;
  • Ultra-high sensitivity and low noise;
  • USB3.0(compatible with USB2.0 protocol） / GigE data transmission interface ;
  • Provides advanced video and image processing application software ToupView, compatible with Windows/Linux/OSX multi-platform SDK, support native C/C++, C#/VB.Net, DirectShow, Twain API;
  • Supports external triggering, digital I/O and free-running modes;
  • Supports ROI, flip, bit-depth switching and other features;

    • Specification

    Introduction to SWIR series ToupCam machine vision cameras

    Machine Vision Camera help manual(Click to download)

    The cameras mentioned in this manual are imaging capture devices which use USB3.0 / GigE to transmit uncompressed images in real time. They support image acquisition and parameter setting (such as working mode, image parameter adjustment etc.) through client-side user-friendly software.

    SWIR(Short-Wavelength Infrared) series are TE-Cooling USB3.0 / GigE InGaAs cameras;

    IUX series is USB3.0 interface cameras for industrial applications. It includes IUA，IUB and IUC.

    IUA is mainly for the 1/2.8”~1.1”sensor；

    IUB is mainly for the GSENSE sensor with sensor size 1/1.1”~1.7”；

    IUC is for the APS and full frame sensor(2.7”);

    I3ISPM series is USB3.0 interface color camera for industrial applications, having built-in hardware ISP to ensure color reproduction and higher video speed. The resolution coverage is from 0.5MP to 20MP.

    I3CMOS series is USB3.0 interface monochrome camera for industrial applications. The resolution coverage is from 0.5MP to 20MP.

    KMA means black/white camera and KPA means color camera which having built-in hardware ISP to ensure color reproduction and higher video speed. The resolution coverage is from 1.7MP to 43MP.

    SWIR series camera specifications (SWIR, 4)

    Order Code Sensor & Size(mm) Pixel(μm) G Sensitivity
    Dark Signal    		 Interface FPS/Resolution Binning Exposure
    SWIR1300KMA 1.3M/IMX990(M,GS)
    1/2”(6.40x5.12)
    Buit-in TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 USB3 200@1280x1024
    392@640x512    		 1x1
    1x1    		 15us~60s
    SWIR1300KMB 1.3M/IMX990(M,GS)
    1/2”(6.40x5.12)
    External TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 USB3 200@1280x1024
    392@640x512    		 1x1
    1x1    		 15us ~60s
    SWIR330KMA 0.33M/IMX991(M,GS)
    1/4”(3.20x2.56)
    Buit-in TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 USB3 400@640x512
    753@320x256    		 1x1
    1x1    		 15us~60s
    SWIR330KMB 0.33M/IMX991(M,GS)
    1/4”(3.20x2.56)
    External TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 USB3 400@640x512
    753@320x256    		 1x1
    1x1    		 15us~60s
    SWIR1300KMA-G 1.3M/IMX990(M,GS)
    1/2”(6.40x5.12)
    Buit-in TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 GigE 90@1280x1024
    253@640x512    		 1x1
    1x1    		 15us~60s
    SWIR1300KMB-G 1.3M/IMX990(M,GS)
    1/2”(6.40x5.12)
    External TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 GigE 90@1280x1024
    253@640x512    		 1x1
    1x1    		 15us~60s
    SWIR330KMA-G 0.33M/IMX991(M,GS)
    1/4”(3.20x2.56)
    Buit-in TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 GigE 258.8@640x512
    486.1@320x256    		 1x1
    1x1    		 15us~60s
    SWIR330KMB-G 0.33M/IMX991(M,GS)
    1/4”(3.20x2.56)
    External TEC    		 5x5 121mV with 1/30s
    1.0mV with 1/30s    		 GigE 258.8@640x512
    486.1@320x256    		 1x1
    1x1    		 15us~60s

     

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